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Accuracy analysis of the 2200evo
Spanjer, S.A.J. (2011) Accuracy analysis of the 2200evo.
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| Abstract: | Abstract Internship Datacon Tirol I completed the internship in the second year of the master Mechanical Automation at Datacon in Tirol, Austria. Datacon is a manufacturer of die-bonder machines. These machines are pick-and-place machines of chips (also called dies). A robotic arm picks dies from a sawed wafer and places it on the bonding area. The accuracy of this process is 25 μm @ 3 |
| Item Type: | Internship Report (Master) |
| Faculty: | ET: Engineering Technology |
| Subject: | 52 mechanical engineering |
| Programme: | Mechanical Engineering MSc (60439) |
| Link to this item: | https://purl.utwente.nl/essays/60140 |
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