University of Twente Student Theses


Het ontwikkelen van een chiphouder, waarbij gebruik wordt gemaakt van 3D-printtechnieken

Doorn, Rowan van (2014) Het ontwikkelen van een chiphouder, waarbij gebruik wordt gemaakt van 3D-printtechnieken.

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Abstract:To complete the Bachelor Industrial Design at the University of Twente, the graduation assignment has been fulfilled at the Knowledge Centre of Design and Technology. This assignment is part of a long term project where the goal is to research if it is possible to create chip packages of complex microfluidic chips with additive manufacturing methods. This assignment is the first step in this two year research project, where the chip package and the microfluidic interface will be developed for a Micro Coriolis Chip. The Micro Coriolis Chip is a fragile sensor, which is able to measure very small amounts of flow. The chip cannot withstand shocks, bumps or force which can come during the connection of interfaces. This chip package must improve the robustness. There are also several methods of additive manufacturing to consider to produce the chip holder. By developing the chip holder there are several alignment and parallelism problems, which are defined and analyzed in the analysis phase. De chip package is assembled by an assembly worker and is done by hand in a ‘clean room’, with a few alignment tools. There are few types of holders and fluidic interfaces currently available on the market, but these do not meet the requirements set for the developed chip package. It will be researched whether a 3D printable package can be developed, because you can create complex internal structures with this technique. There are several additive manufacturing methods investigated and these have only a few production processes with a reasonable accuracy for the scale of this design. The chip module will have operation conditions under high pressure and varying temperatures, while there are chemicals running through the package. De chip must operate well under these conditions in order to meet the requirements set by the manufacturer. That’s why the solutions for the analyzed problems are developed in the Idea phase. A few ideas are further elaborated and several experiments and a simulation are carried out to evaluate these ideas. All partial solutions are incorporated in a morphological scheme, to select solutions paths to develop four concepts. The first concept has a cone ferrule as a key feature which is glued on to the chip. The pressure delivered by the top cover provides the force to a good seal. Thee coned ferrule still offers a good seal, even under a misalignment angle. In addition, the coned ferrule provides a self-alignment when the chip is assembled in the holder. A disadvantage of the concept is the planar alignment of the coned ferrule with this chip. The second concept uses a vacuum to keep parts in position after they have been aligned properly, so they can be glued in position. The third concept uses the same principles as the first concept, but the key feature in this concept is the pre-alignment of the parts, which is realized with a wire, where the coned ferrule provides the eventual alignment. The last concept is an iteration of the Micronit® chip holder found in the market research, this concept uses a lever to provide sealing pressure. The problem with this holder was the parallelism of the chip and the holder, which caused problems in the sealing. The fourth concept uses the same principle but tackled this problem. All four concepts are evaluated and as a result concept 1,3 and 4 seemed to have good partial solutions which can be combined in one final design. This final concept uses the coned ferrule and the pre-alignment with the wire. De sealing force is created after placing the chip package in the system, this package is mounted with cylinder head screws with a torque wrench to provide a continuous sealing force. The assembly of the chip is eased by using alignment features in the package. The chip will be manufactured with Selective Laser Sintering of PEEK, this is a high accuracy process and PEEK has good material properties. One can be satisfied with the results in this assignment, since almost all of the preset objectives are achieved. In the follow-up project there should be more experimenting and research for additive manufacturing methods and materials.
Item Type:Essay (Bachelor)
Faculty:ET: Engineering Technology
Subject:20 art studies
Programme:Industrial Design BSc (56955)
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