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The impact of temperature and mechanical stressinduced by packaging mold on the accuracy of CMOS integrated LC oscillators

Ruiter, R. de (2020) The impact of temperature and mechanical stressinduced by packaging mold on the accuracy of CMOS integrated LC oscillators.

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Abstract:In this paper a model of a CMOS integrated plate capacitor and the effects of thermal expansion due to the packaging induced mechanical stress is presented. Simulations show the average capacitance sensitivity of 0.462 [aF/K] over the temperature range between 0°C (273.15 K) and 175°C (448.15 K). Using this sensitivity in combination with Colpitss oscillator designed in A. S. Delke 2020 [1], the worst-case frequency error, induced by the mechanical stress of the packaging mold, is found to be 13.65 [ppm/K].
Item Type:Essay (Bachelor)
Faculty:EEMCS: Electrical Engineering, Mathematics and Computer Science
Subject:53 electrotechnology
Programme:Electrical Engineering BSc (56953)
Link to this item:https://purl.utwente.nl/essays/85281
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