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The impact of temperature and mechanical stressinduced by packaging mold on the accuracy of CMOS integrated LC oscillators

Ruiter, R. de (2020) The impact of temperature and mechanical stressinduced by packaging mold on the accuracy of CMOS integrated LC oscillators.

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Full Text Status:Access to this publication is restricted
Embargo date:1 July 2024
Item Type:Essay (Bachelor)
Faculty:EEMCS: Electrical Engineering, Mathematics and Computer Science
Subject:53 electrotechnology
Programme:Electrical Engineering BSc (56953)
Link to this item:http://purl.utwente.nl/essays/85281
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