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Accuracy analysis of the 2200evo

Spanjer, S.A.J. (2011) Accuracy analysis of the 2200evo.

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Abstract:Abstract Internship Datacon Tirol I completed the internship in the second year of the master Mechanical Automation at Datacon in Tirol, Austria. Datacon is a manufacturer of die-bonder machines. These machines are pick-and-place machines of chips (also called dies). A robotic arm picks dies from a sawed wafer and places it on the bonding area. The accuracy of this process is 25 μm @ 3
Item Type:Internship Report (Master)
Faculty:ET: Engineering Technology
Subject:52 mechanical engineering
Programme:Mechanical Engineering MSc (60439)
Link to this item:http://purl.utwente.nl/essays/60140
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