The impact of temperature and mechanical stressinduced by packaging mold on the accuracy of CMOS integrated LC oscillators

In this paper a model of a CMOS integrated plate capacitor and the effects of thermal expansion due to the packaging induced mechanical stress is presented. Simulations show the average capacitance sensitivity of 0.462 [aF/K] over the temperature range between 0°C (273.15 K) and 175°C (448.15 K). Using this sensitivity in combination with Colpitss oscillator designed in A. S. Delke 2020 [1], the worst-case frequency error, induced by the mechanical stress of the packaging mold, is found to be 13.65 [ppm/K].