Immersion Cooling of a Sphere

This research focuses on cooling a copper sphere immersed in three different dielectric liquids, serving as a foundational study for the future optimization of heat sink shapes in immersion cooling technologies. By examining the cooling process in different liquids, we have determined that the type of liquid has a relatively minor impact on the overall cooling rate. However, it is still possible to tell which one cools the sphere faster due to the usage of an OpenFOAM. Despite this, the simulation of a sphere immersed in a liquid presents significant challenges due to the complex interactions between the sphere and the liquid. These challenges must be addressed to advance the understanding and development of more effective heat sinks.